? semiconductor components industries, llc, 2014 october, 2014 ? rev. 0 1 publication order number: PCS2I2309NZ/d PCS2I2309NZ 3.3 v 1:9 clock buffer functional description PCS2I2309NZ is a low ? cost high ? speed buffer designed to accept one clock input and distribute up to nine clocks in mobile pc systems and desktop pc systems. the device operates at 3.3 v and outputs can run up to 133.33 mhz. PCS2I2309NZ is designed for low emi and power optimization and consumes less than 32 ma at 66.6 mhz, making it ideal for the low ? power requirements of mobile systems. it is available in a 16 ? pin soic package. features ? one ? input to nine ? output buf fer/driver ? buffers all frequencies from dc to 133.33 mhz ? low power consumption for mobile applications less than 32 ma at 66.6 mhz with unloaded outputs ? input ? output delay: 6 ns (max) ? output ? output skew less than 250 ps ? 16 ? pin soic package ? supply voltage: 3.3 v 0.3 v ? these devices are pb ? free and are rohs compliant buf_in output1 output2 output3 output4 output5 output6 output7 output8 output9 figure 1. block diagram www.onsemi.com see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information soic ? 16 case 751b ? 05 2i2309nz= specific device code a = assembly location wl = wafer lot y = year ww = work week g = pb ? free package 2i2309nz awlywwg 1 16 marking diagram
PCS2I2309NZ http://onsemi.com 2 figure 2. pin configuration 1 2 3 413 14 15 16 output8 output7 output9 v dd buf_in output1 output2 v dd 5 6 7 89 10 11 12 PCS2I2309NZ output6 output5 gnd gnd gnd output3 output4 v dd table 1. pin description pin # pin name description 4, 8, 13 v dd 3.3 v digital supply voltage 5, 9, 12 gnd ground 1 buf_in input clock 2, 3, 6, 7, 10, 11, 14, 15, 16 output [1:9] outputs table 2. absolute maximum ratings parameter min max unit supply voltage to ground potential ? 0.5 +4.6 v dc input voltage (except ref) ? 0.5 v dd + 0.5 v dc input voltage (ref) ? 0.5 7 v storage temperature ? 65 +150 c max. soldering temperature (10 sec) 260 c junction temperature 150 c static discharge voltage (as per jedec std22 ? a114 ? b) 2000 v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. table 3. operating conditions parameter description min max unit v dd supply voltage 3.0 3.6 v t a operating temperature ? 40 +85 c c l load capacitance, fout < 100 mhz 30 pf load capacitance, 100 mhz < fout < 133.33 mhz 15 pf c in input capacitance 7 pf buf_in, output [1:9] operating frequency dc 133.33 mhz t pu power ? up time for all v dd ?s to reach minimum specified voltage (power ramps must be monotonic) 0.05 50 ms
PCS2I2309NZ http://onsemi.com 3 table 4. electrical characteristics symbol parameter test conditions min max units v il input low voltage (note 1) 0.8 v v ih input high voltage (note 1) 2.2 v i il input low current v in = 0 v 50 a i ih input high current v in = v dd 100 a v ol output low voltage (note 2) i ol = 8 ma 0.4 v v oh output high voltage (note 2) i oh = ? 8 ma 2.4 v i dd supply current 0 c to +70 c unloaded outputs at 66.66 mhz 30 ma ? 40 c to +85 c 32 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. buf_in input has a threshold voltage of v dd /2 2. parameter is guaranteed by design and characterization. it is not tested in production. table 5. switching characteristics (note 3) symbol parameter test conditions min typ max units t 3 rise time (note 4) measured between 0.8 v and 2.0 v 1.5 2 ns t 4 fall time (note 4) measured between 2.0 v and 0.8 v 1.5 2 ns t d duty cycle (note 4) = t 2 t 1 measured at 1.4 v (for an input clock duty cycle 50%) 45 50 55 % t 5 output to output skew (note 4) all outputs equally loaded 250 ps t 6 propagation delay, buf_in rising edge to output rising edge (note 4) measured at v dd /2 4 6 ns 3. all parameters specified with loaded outputs. 4. parameter is guaranteed by design and characterization. it is not tested in production.
PCS2I2309NZ http://onsemi.com 4 switching waveforms figure 3. duty cycle timing t 2 t 1 1.4 v output 1.4 v 1.4 v figure 4. all outputs rise/fall time t 3 output t 4 0.8 v 2 v 0.8 v 2 v vdd 0 v figure 5. output ? output skew t 5 output output 1.4 v 1.4 v figure 6. input ? output propagation delay output input v dd /2 v dd /2 figure 7. test circuit gnd output PCS2I2309NZ cl +3.3 v v dd buf ? in 3 3 0.1 f
PCS2I2309NZ http://onsemi.com 5 table 6. ordering information part number marking package type temperature p2i2309nzg ? 16 ? st 2i2309nz 16 ? pin 150 ? mil soic, green ? 40 c to +85 c PCS2I2309NZg16sr 2i2309nz 16 ? pin 150 ? mil soic, tape and reel, green ? 40 c to +85 c note: a ?g? placed at the end of last row of marking or just below the last row toward the center of package indicates pb ? free for 16 pin soic packages.
PCS2I2309NZ http://onsemi.com 6 package dimensions soic ? 16 case 751b ? 05 issue k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p ? b ? ? a ? m 0.25 (0.010) b s ? t ? d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 6.40 16x 0.58 16x 1.12 1.27 dimensions: millimeters 1 pitch soldering footprint 16 89 8x on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warrant y, representation or guarantee regarding the suitability of it s products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 PCS2I2309NZ/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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